Find the latest Dymax press releases to learn about global and local company initiatives.
Curing speed enables faster processing and reduces cost.
Dymax Corporation offers Ultra Light-Weld® 9008, a light-curable encapsulant engineered to rapidly encapsulate and seal electronic components in chip-on-flex or chip-on-board applications.
Dymax Multi-Cure® 9-20557 cures in seconds upon exposure to UV/Visible light and is designed for rapid conformal coating of printed circuit boards and other electronic assemblies.
SpeedMask® 730-BT is a masking resin formulated to provide excellent surface protection during chemical milling/etching, plating, anodizing, and aggressive grit-blasting operations aiding in the manufacturing, overhaul, repair, and rework of turbine engine blades, vanes, and other turbine components as well as many other metal finishing applications.
The Dymax MD® "1200" series adhesives are ideal for rapid bonding of a wide variety of substrates found in reservoirs, plastic housings, respiratory devices, needles, syringes, tube sets, fittings, and other medical devices.
Dymax is proud to introduce the BlueWave® MX-275 high-intensity flood-curing system.
Senior R&D Manager of the adhesives team at Dymax, Dr. Aysegul Kascatan Nebioglu, was a presenter at the IPC/ APEX Expo 2019 which took place on January 26 to 31 in San Diego, California.
Dymax Corporation, a leading manufacturer of rapid-cure materials and equipment, will exhibit at MRO Americas in Booth #2101, April 9-11, 2019 at the Georgia World Conference Center in Atlanta, GA.
Dymax Corporation is pleased to announce the participation of its Senior R&D Manager of the Adhesives team at the International Conference for Electronics Enabling (ICEET-2019) in Ontario, Canada.