Light-Curable Encapsulant Helps Maximize Assembly and Production Speeds

Dymax Corporation offers Ultra Light-Weld^® 9008, a light-curable encapsulant engineered to rapidly encapsulate and seal electronic components in chip-on-flex or chip-on-board applications.  Tough and flexible, the product cures in seconds and is easily incorporated into automated systems to maximize microelectronic assembly and production speeds.  With resistance to humidity and thermal shock, it effectively protects components and improves their reliability.

Ultra Light-Weld^® 9008 forms flexible, highly moisture-resistant bonds to a variety of surfaces including polyimide (Kapton^®), glass, epoxy board, metal, and PET.  It remains flexible to -40°C, making it ideal for COF applications, while its 8,000 cP viscosity and thixotropic flow properties allow for easy formation of a protective encapsulant layer.  9008 contains no sharp abrasive mineral or glass fillers, and its combination of low Tg and modulus means low stress.  It provides superior protection for glob-top and chip-on-board applications and is ideal for encapsulating IC’s in flex circuits.  

This solvent-free, one-part encapsulant has a low dielectric constant for high-frequency applications and is in full compliance with RoHS Directives 2002/95/EC and 2003/11/EC.