- UV/Visible Light Cure
- Low Outgassing
- Low Ionic Content Compliance with Mil-Std 883 Method 5011
- High Viscosity
- Halogen Free
- Silicone Free
- No Solvents Added
- Mil Std 883 Method 5011 Compliant
- Adhesion to Various PCB Substrates
- Meets ASTM E595 Low Outgassing
- NASA MAPTIS Listed (Material Code 09907)
- Slump Resistance @ 90° up to 72 Hours
- 23 Gauge Needle Tip Minimum for Dispensing
- Jetting Compatible
- RoHS and REACH Compliant
Ruggedizing Adhesive
9773
Light-Cure BGA, CSP Ruggedizing Adhesive
Dymax 9773 is a low outgassing, low-ionic content, high-performance light-cure staking/ruggedizing material especially formulated to stabilize critical components on printed circuit boards in missiles, satellites, and spacecraft. This material is designed for rapid on-demand broad-spectrum curing.
Typical applications include:
- Reinforcement of Fine-Pitch or Leadless Components on Printed Circuit Boards (PCBs)
- Ruggedization/Staking Material
- Shock Absorption
- Underfill Alternative
- Encapsulant
Dymax staking materials contain no nonreactive solvents and cure upon exposure to light. The ability of Dymax materials to cure in seconds enables faster processing, greater output, and lower processing costs. When cured with Dymax light-curing spot lamps, focused-beam lamps, flood lamps, or conveyor systems, they deliver optimum speed and performance for printed circuit boards. Dymax lamps offer the ideal balance of UV and visible light for the fastest, deepest cures.
This product is in full compliance with RoHS directives 2015/863/EU.
Features
Typical Properties
Looking for additional technical specifications. Download a Product Datasheet in our Resource Library or talk with our technical experts.
Get in touch| Property | Values |
|---|---|
| Viscosity, cP | 54,000 |
| Uncured appearance | Off-White to Slate Grey Translucent Gel |
| Recommended substrates | PCB; Silicon; Leadframe; Ceramic |
Looking for additional technical specifications. Download a Product Datasheet in our Resource Library or talk with our technical experts.
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Dymax 9773 Ruggedizing & Staking Adhesive
Dymax 9773 is a light-curable ruggedizing and staking adhesive engineered to secure and protect critical components in the most demanding aerospace environments. With features like low outgassing and low ionic content, this adhesive is designed to meet NASA standards. Learn more in this short video.
Light-Curable Adhesives for Electronic Staking Applications
Adhesive staking is a process commonly used to connect electronic components to printed circuit boards. This process provides extra protection and mechanical support to PCB components that may be damaged due to vibration, shock, or other handling. Dymax offers a variety of light-curable adhesives formulated for electronics staking applications, which cure “on-demand” in just seconds with UV/Visible light. Once cured, the PCB’s are immediately ready for the next assembly step, resulting in a faster, more efficient manufacturing process.
Ruggedization Animation
Ruggedization Animation
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